Heat Transfer Enhancement of Copper-Water Nanofluids in a Lid-Driven Enclosure with Two Mutually Orthogonal Heated Plates

Xiao Feng Wang; Ding Fang Li; Feng Hui

doi:10.4028/www.scientific.net/AMR.268-270.263

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 268-270Heat Transfer Enhancement of Copper-Water...

Heat Transfer Enhancement of Copper-Water Nanofluids in a Lid-Driven Enclosure with Two Mutually Orthogonal Heated Plates

Abstract:

This paper presents the results of a numerical study on the mixed convection in a lid-driven enclosure filled with a copper-water nanofluid and induced by two mutually orthogonal heated thin plates. Two different boundary conditions (isothermal boundary condition and isoflux boundary condition) are considered. The coupled gonverning equations are solved numerically by a fully fourth-order accurate compact finite difference method. A parametric study is conducted and a set of graphical results is presented and discussed to elucidate that significant heat transfer enhancement can be obtained due to the presence of nanoparticles.

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Advanced Materials Research (Volumes 268-270)

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263-268

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https://doi.org/10.4028/www.scientific.net/AMR.268-270.263

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Online since:

July 2011

Authors:

Xiao Feng Wang, Ding Fang Li, Feng Hui

Keywords:

Fully HOC Scheme, Isoflux, Isothermal, Mixed Convection, Nanofluid, Pseudo-Time Method

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