Research on MID Application in RFID Based on Intelligent Materials

Abstract:

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In this paper, the three-dimensional molding mechanical and electrical integration unit Molded Interconnect Devices (MID) is introduced. It is a new type of electronic component. And the following part of the article presents the Internet of Things (IOT). From the design and manufacture process, the paper describes the possibility and necessity using MID in IOT technology, as RFID and Embedded System. In the end, the MID design process is presented.

Info:

Periodical:

Advanced Materials Research (Volumes 282-283)

Edited by:

Helen Zhang and David Jin

Pages:

244-247

DOI:

10.4028/www.scientific.net/AMR.282-283.244

Citation:

W. J. Xu "Research on MID Application in RFID Based on Intelligent Materials", Advanced Materials Research, Vols. 282-283, pp. 244-247, 2011

Online since:

July 2011

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Price:

$35.00

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