Research on MID Application in RFID Based on Intelligent Materials

Wen Jin Xu

doi:10.4028/www.scientific.net/AMR.282-283.244

Paper Titles

Effect of Paddy Hermetic Plastic Tent MAP on Free Fatty Acid Property of Rice during Storage
p.227

Exponential Stability of Stochastic Age-Dependent Population with Diffusion
p.231

Research on New Botnet Detection Strategy Based on Information Materials
p.236

Optimal Recovery for Some Infinitely Differentiable Periodic Functions
p.240

Research on MID Application in RFID Based on Intelligent Materials
p.244

Genetic Regulatory Network Analysis for Rpe65 in the Eye of BXD Mice
p.248

Research on Software Aggregation to Service Aggregation
p.253

DEST Simulation Using the Window on the Building Energy Consumption
p.257

Research on the Development of Clothing Brand Position under the Modern Consumer Culture
p.261

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 282-283Research on MID Application in RFID Based on...

Research on MID Application in RFID Based on Intelligent Materials

Abstract:

In this paper, the three-dimensional molding mechanical and electrical integration unit Molded Interconnect Devices (MID) is introduced. It is a new type of electronic component. And the following part of the article presents the Internet of Things (IOT). From the design and manufacture process, the paper describes the possibility and necessity using MID in IOT technology, as RFID and Embedded System. In the end, the MID design process is presented.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 282-283)

Pages:

244-247

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.282-283.244

Citation:

Cite this paper

Online since:

July 2011

Authors:

Wen Jin Xu

Keywords:

Internet of Things (IOT), Mid, Molded Interconnect Devices, Radio Frequency Identification (RFID)

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Three-Dimensional Automatic Routing in Design of Molded Interconnect Devices (MID) K Feldmann, YP Shi, Y Zhuo - Production Engineering, (2003).

Google Scholar

[2] SMD placement on three-dimensional circuit boards Electronics Packaging Manufacturing, IEEE Transactions onVolume 22, Issue 2, Apr 1999 Page(s): 147 – 150.

DOI: 10.1109/6104.778174

Google Scholar

[3] Rukzio, E., Wetzstein, S., Schmidt, A.: A Framework for Mobile Interactions with the Physical World. Invited paper special session Simplification of user access to ubiquitous ICT services" at the Wireless Personal Multimedia Communication (WPMC, 05)conference, Sept 18-22, 205 - Aalborg, Denmark.

Google Scholar

[4] High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP apos; 04. Proceeding of the Sixth IEEE CPMT Conference.

DOI: 10.1109/hpd.2004.1346657

Google Scholar

[5] Three-Dimensional Automatic Routing in Design of Molded Interconnect Devices (MID) K Feldmann, YP Shi, Y Zhuo - Production Engineering, (2003).

Google Scholar

[6] Alternative Placement Systems for Three-Dimensional Circuit Boards K. Feldmannb and S. Krimib CIRP Annals - Manufacturing Technology Volume 47, Issue 1, 1998, Pages 23-26.

DOI: 10.1016/s0007-8506(07)62777-2

Google Scholar

[7] 3D gridless routing for the design of molded interconnect devices (MID) K Feldmann, Y Zhuo, C Alvarez - Production Engineering, (2005).

Google Scholar