Research on MID Application in RFID Based on Intelligent Materials
In this paper, the three-dimensional molding mechanical and electrical integration unit Molded Interconnect Devices (MID) is introduced. It is a new type of electronic component. And the following part of the article presents the Internet of Things (IOT). From the design and manufacture process, the paper describes the possibility and necessity using MID in IOT technology, as RFID and Embedded System. In the end, the MID design process is presented.
Helen Zhang and David Jin
W. J. Xu "Research on MID Application in RFID Based on Intelligent Materials", Advanced Materials Research, Vols. 282-283, pp. 244-247, 2011