Research on a New Type of Ultrasonic Polishing Vibrator

Abstract:

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Aiming at the ultrasonic vibration polishing technology of silicon wafer, this paper proposes a disc-shaped ultrasonic piezoelectric polishing vibrator of out-of-plant bending travalling wave. Basing on numerical analysis, the principle prototype of the polishing vibrator has been designed and produced, and then tested. This polishing vibrator can be used in polishing process of semiconductor silicon wafer.

Info:

Periodical:

Advanced Materials Research (Volumes 299-300)

Edited by:

Jianzhong Wang and Jingang Qi

Pages:

1132-1135

DOI:

10.4028/www.scientific.net/AMR.299-300.1132

Citation:

Q. He et al., "Research on a New Type of Ultrasonic Polishing Vibrator", Advanced Materials Research, Vols. 299-300, pp. 1132-1135, 2011

Online since:

July 2011

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Price:

$35.00

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