The Optimization Design of Cheese Bionic Kneader with Response Surface Method(RSM)
p.1115
p.1115
Distributed and Cooperative Organization of Information Platform for Manufacturing Clusters
p.1120
p.1120
The Study on CAD Technology of Reconfigurable and Module for Vertical Bag Packaging Machine
p.1124
p.1124
Preparation of Bio Tissue Micro Array Based on NC Positioning and Image Processing Technology
p.1128
p.1128
Research on a New Type of Ultrasonic Polishing Vibrator
p.1132
p.1132
Residual Stress Measurement for Coated Film on Cold Work Tool Steel
p.1136
p.1136
Influence Analysis of Machining Errors on Bearing Capability of Internal Gear Pair
p.1142
p.1142
Effect of Shoulder Diameter on the Resulting Interfacial Regions of Friction Stir Welds between Aluminium and Copper
p.1146
p.1146
Effect of Scan Velocity on Resulting Curvatures during Laser Beam Bending of AISI 1008 Steel Plates
p.1151
p.1151
Research on a New Type of Ultrasonic Polishing Vibrator
Abstract:
Aiming at the ultrasonic vibration polishing technology of silicon wafer, this paper proposes a disc-shaped ultrasonic piezoelectric polishing vibrator of out-of-plant bending travalling wave. Basing on numerical analysis, the principle prototype of the polishing vibrator has been designed and produced, and then tested. This polishing vibrator can be used in polishing process of semiconductor silicon wafer.
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Periodical:
Advanced Materials Research (Volumes 299-300)
Pages:
1132-1135
Citation:
Online since:
July 2011
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© 2011 Trans Tech Publications Ltd. All Rights Reserved
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