Research on a New Type of Ultrasonic Polishing Vibrator
Aiming at the ultrasonic vibration polishing technology of silicon wafer, this paper proposes a disc-shaped ultrasonic piezoelectric polishing vibrator of out-of-plant bending travalling wave. Basing on numerical analysis, the principle prototype of the polishing vibrator has been designed and produced, and then tested. This polishing vibrator can be used in polishing process of semiconductor silicon wafer.
Jianzhong Wang and Jingang Qi
Q. He et al., "Research on a New Type of Ultrasonic Polishing Vibrator", Advanced Materials Research, Vols. 299-300, pp. 1132-1135, 2011