Microstructure and Mechanical Property of GH4169 Joints by Vacuum Diffusion Bonding

Zhuo Ran Li; Bing Liu; Xiang Long Zhang; Ji Cai Feng

doi:10.4028/www.scientific.net/AMR.314-316.1180

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 314-316Microstructure and Mechanical Property of GH4169...

Microstructure and Mechanical Property of GH4169 Joints by Vacuum Diffusion Bonding

Abstract:

Vacuum diffusion bonding characteristics of GH4169, interface bonding holes and mechanical properties of the joints were investigated. The experimental results without interlayer showed that, with the increasing of diffusion time and diffusion pressure in the range of 950-1150°C and 20-40MPa, the number and size of interface bonding holes decreased and the maximum tensile strength of the diffusion bonding joint was 658 MPa, but the discontinuous interface holes still existed. With the Cu interlayer, interfaces between the solid solution layer and the base metal were prone to intimate contact and the maximum tensile strength of the bonding joint was 745 MPa.

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Advanced Manufacturing Technology, ADME 2011

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Periodical:

Advanced Materials Research (Volumes 314-316)

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1180-1183

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https://doi.org/10.4028/www.scientific.net/AMR.314-316.1180

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Online since:

August 2011

Authors:

Zhuo Ran Li, Bing Liu, Xiang Long Zhang, Ji Cai Feng

Keywords:

Diffusion Bonding (DB), GH4169, Interlayer, Tensile Strength

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