Stress Intensity Factor for Interfacial Cracks in Bi-Materials Using Incompatible Numerical Manifold Method

Gao Feng Wei; Hong Fen Gao; Hai Hui Jiang

doi:10.4028/www.scientific.net/AMR.327.109

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 327Stress Intensity Factor for Interfacial Cracks in...

Stress Intensity Factor for Interfacial Cracks in Bi-Materials Using Incompatible Numerical Manifold Method

Abstract:

Incompatible numerical manifold method (INMM) uses interpolation functions based on the concept of partition of unity, and considers the asymptotic solution and the discontinuity of displacement. This paper describes the application of INMM to bi-material interfacial crack. The two dimensional near-tip asymptotic displacement functions are added to the trial function approximation. This enables the domain to be modeled by manifold elements without explicitly meshing the crack surfaces. The crack-tip enrichment functions are chosen as those that span the asymptotic displacement fields for an interfacial crack. The INMM facilitates the incorporation of the oscillatory nature of the singularity within a conforming manifold element approximation. The complex stress intensity factors for bi-material interfacial cracks are numerically evaluated. Good agreement between the numerical results and the analytical solutions for benchmark interfacial crack problems is realized.

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Periodical:

Advanced Materials Research (Volume 327)

Pages:

109-114

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.327.109

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Online since:

September 2011

Authors:

Gao Feng Wei, Hong Fen Gao, Hai Hui Jiang

Keywords:

Crack-Tip Field, Fracture Mechanics, Incompatible Numerical Manifold Method, Interface Crack, Stress Intensity Factor (SIF)

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