Study on Thermal Assisted Direct Bonding of Glasses for Lab-on-Chip Application through Surface Activation Process

Abstract:

Surface treatment before glass bonding is an important and critical issue for glass-based lab-on-chip fabrication. In the present article we verified five different activation methods for obtaining sound thermal assisted direct bonding (TADB) on glasses. Glass surface has been investigated by means of water contact angle, X-ray photoelectron spectroscopy (XPS). The optimum surface activation method for TADB on glasses was found to be H₂SO₄:H₂O₂ (3:1 by volume) followed by HNO₃. By using the TADB optimized activation method, the glass bonding strength higher than 32MPa was obtained with a glass the roughness of 50 nm.

• Periodical: Advanced Materials Research (Volume 327)
• Pages: 124-129
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.327.124
• Online since: September 2011
• Authors: Qiu Ling Chen, Qiu Ling Chen, Monica Ferraris
• Keywords: Bonding Strength, Glass Direct Bonding, Lab-on-Chip, Surface Activation

References

[1] Kricka L J, Faro I, Heyner S, J. Pharmaceut. Biomed. Vol. 15- 1443(1997), p.7.

[2] Che-Hsin Lin, Gwo-Bin Lee, Yen-Heng Lin J. Micromech. Microeng. Vol. 11 (2001). p.726.

[3] Gui C, Albers H, Gardeniers JGE, J Microsyst Technol Vol. 3(1997), p.122.

[4] Chen Q, Milanese D, Chen Q, J. Non-Cryst Solids Vol. 354(2008), p.1230.

[5] Chen Q, Chen Q, Milanese D, J. Microsyst Technol Vol. 15(2009), p.1067.

[6] Chen Q, Chen Q, Milanese D, J. Microsyst Technol Vol. 15(2009), p.1873.

[7] Chen Q, Chen Q, Milanese D, Microsyst Technol Vol. 16(2010), p.527.

[8] Qin-Yi Tong, Ulrich M. Gosele, J. Adv. Mater. Vol. 17(1999), p.1409.

[9] Lai Shin I., Lin H. Y., Materials Chemistry and Physics Vol. 83, (2004), p.265.

[10] Imran Fazal, Erwin Berenschot, Rik Deboer, Actuators and Microsystems (2005), p.936.

[11] Zhi X. X, Guo Y. W, Zhi H. L, Sensors and Actuators A: Physical Vol. 72, 1(1999) p.46.

[12] Lee D. J, Byeong Kwon Ju, J. Micromech. Microeng. Vol. 9(1999), p.313.

[13] Qin-Yi Tong, Ulrich M. Gosele, J. Adv. Mater. Vol. 17 (1999), p.1409.

[14] Sayah A., D. Solignac, T. Cueni, J. App. Physical sensor and actuators Vol. 84(2000), p.103.

[15] Haisma Jan, Gijsbertus A.C.M. Spierings, Philips J. Res. Vol. 49(1995), p.23.

[16] Hattori T., Springer, Germany, (1998), p.504.

[17] Han Y., Mayer D., Offenhausser A., Thin Solid Films Vol. 510(2006), p.175.

[18] Suga T., Kim T.H. and Howlader M.M.R., IEEE (2004) p.484.