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Rheological Behavior of Silver Paste Prepared from Nanoparticles

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Abstract:

A paste with as low as 300°C sintering temperature was prepared by using nano silver particles and ethyl cellulose solution. The rheological and thixotropic behaviors of the typical paste were characterized and their effects on the screen printing ability were analyzed in details. The paste demonstrates a typical shear thinning rheological behavior and thixotropic of pseudoplastic fluid. The apparent viscosity decreased rapidly with the increase of the shear rate. The paste is proper for the manufacturing electrical components at a low temperature as low as 300°C.

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Periodical:

Advanced Materials Research (Volume 327)

Pages:

120-123

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.327.120

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Online since:

September 2011

Authors:

Shi Yong Luo, Juan Chen, Wen Cai Xu, Xin Lin Zhang, Li Xia Huo

Keywords:

Low Sintering Temperature, Nano-Silver Paste, Rheological Behavior, Thick Film

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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