Determination of Residual Stress of Hard Film/Soft Substrate Specimens via Unloading Results of Nanoindentation Tests

Abstract:

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A method used to determine the residual stress in a hard film deposited on a soft substrate via the unloading load-depth curves was proposed. The unloading curves with transitional behaviors were used to determine the film deflection stiffness, and then the residual stresses were obtained. Significant extra stresses were induced by a cube corner indenter at large depth. In contrast, the indentation-induced stresses could be neglected in cases of Berkovich indentation at relatively small depths.

Info:

Periodical:

Advanced Materials Research (Volumes 328-330)

Edited by:

Liangchi Zhang, Chunliang Zhang and Zichen Chen

Pages:

843-848

DOI:

10.4028/www.scientific.net/AMR.328-330.843

Citation:

H. H. Nguyen et al., "Determination of Residual Stress of Hard Film/Soft Substrate Specimens via Unloading Results of Nanoindentation Tests", Advanced Materials Research, Vols. 328-330, pp. 843-848, 2011

Online since:

September 2011

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Price:

$35.00

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