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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 328-330Determination of Residual Stress of Hard Film/Soft...

Determination of Residual Stress of Hard Film/Soft Substrate Specimens via Unloading Results of Nanoindentation Tests

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Abstract:

A method used to determine the residual stress in a hard film deposited on a soft substrate via the unloading load-depth curves was proposed. The unloading curves with transitional behaviors were used to determine the film deflection stiffness, and then the residual stresses were obtained. Significant extra stresses were induced by a cube corner indenter at large depth. In contrast, the indentation-induced stresses could be neglected in cases of Berkovich indentation at relatively small depths.

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Periodical:

Advanced Materials Research (Volumes 328-330)

Pages:

843-848

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.328-330.843

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Online since:

September 2011

Authors:

Huu Hung Nguyen, Pal Jen Wei, Jen Fin Lin

Keywords:

Hard Film, Nanoindentation, Residual Stress

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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