The Frontier Analysis of RCS for Micro-Nano Particle
By the method of adding MNP (micron or nano particles) into general solder, the composite electronic solder can be prepared, due to its role of solution or dispersion strengthening, and can improve the thermostable fatigue and creep properties of solder joint, it is also usually named as RCS (reinforced composite solder).Based on researchful analysis of RCS, such as metal particles, particles for high hardness, particles for low expansion coefficient, rare-earth particles and low aggregated particle, and of their reinforced mechanism, the technical requirements of RCS is found, it is also analyzed problems and application prospects of RCS.
Prasad Yarlagadda, Yun-Hae Kim, Zhijiu Ai and Xiaodong Zhang
C. H. Du et al., "The Frontier Analysis of RCS for Micro-Nano Particle", Advanced Materials Research, Vol. 337, pp. 526-531, 2011