Effects of Different Fluxes on the Spreadability of Zn-20Sn Solders

Abstract:

Article Preview

The spreadability of Zn-20Sn solders on Cu substrate was researched by using self-made flux, silver brazing 102 and medium activity rosin (RMA), and the characteristics of intermetallic compounds the appearance of solder joints were compared and analyzed at soldering joints. Results indicated that Zn-20Sn solders exhibited excellent spreadability by using self-made flux. A shoot IMC layer was closed to the solder while a flat IMC layer was presenting adjacent to the Cu substrate and the middle layer. Moreover, the characteristics of IMC and the appearances of soldered joints varied by using different fluxes.

Info:

Periodical:

Edited by:

Prasad Yarlagadda, Yun-Hae Kim, Zhijiu Ai and Xiaodong Zhang

Pages:

546-549

DOI:

10.4028/www.scientific.net/AMR.337.546

Citation:

Y. Y. Sheng et al., "Effects of Different Fluxes on the Spreadability of Zn-20Sn Solders", Advanced Materials Research, Vol. 337, pp. 546-549, 2011

Online since:

September 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.