Microwave Curing of Non-Traditional Polymer Materials Used in Manufacture of Injection Moulds

Abstract:

Microwave heating technology is a cost-effective alternative way for heating and curing of used in polymer processing of various alternate materials. The work presented in this paper addresses the attempts made by the authors to study the glass transition temperature and curing of materials such as casting resins R2512, R2515 and laminating resin GPR 2516 in combination with two hardeners ADH 2403 and ADH 2409. The magnetron microwave generator used in this research is operating at a frequency of 2.45 GHz with a hollow rectangular waveguide. During this investigation it has been noted that microwave heated mould materials resulted with higher glass transition temperatures and better microstructure. It also noted that Microwave curing resulted in a shorter curing time to reach the maximum percentage cure. From this study it can be concluded that microwave technology can be efficiently and effectively used to cure new generation alternate polymer materials for manufacture of injection moulds in a rapid and efficient manner. Microwave curing resulted in a shorter curing time to reach the maximum percentage cure.

• Periodical: Advanced Materials Research (Volume 338)
• Pages: 214-222
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.338.214
• Online since: September 2011
• Authors: Prasad K.D.V. Yarlagadda, Andre Poh, Shu Hau Hsu
• Keywords: Epoxy Resin (ER), Glass Transition Temperature, Microwave Heating, Mould Materials

References

[1] P.K.D.V. Yarlagadda, T.S. Chong, Characterisation of materials behaviour in microwave joining of ceramics, J. Mater. Process. Technol. 84 (1998) 162–174.

[2] A. Olofinjana, P.K.D.V. Yarlagadda, A. Oloyede, Microwave processing of adhesive joints using a temperature controlled feedback system, Int. J. Machine Tools Manuf. 41 (2001) 209–225.

DOI: 10.1016/s0890-6955(00)00060-2

[3] Solid Surface 2001, ATH—filler with an attitude. URL:http://www.solidsurfacemagazine.com/mar 2001.htm.

[4] P.K.D.V. Yarlagadda, A. Ahmed, C.T. Soon, E. Siorgs, Microwave welding of alumina ceramic using a ridge wave guide, in: D.E. Clark, W.H. Sutton, D.A. Lewis (Eds.), Proceedings of the First World Congress on Microwave Processing; Ceram. Trans. 80 (1997) 475–482.

[5] F.Y.C. Boey, B.H. Yap, Microwave curing of an epoxy-amine system: effect of curing agent on the glass-transition temperature, Polym. Test. 20 (2001) 837–845.

DOI: 10.1016/s0142-9418(00)00070-2

[6] J. Wei, M.C. Hawley, J.D. Delong, Comparison of microwave and thermal cure of epoxy resins, Polym. Eng. Sci. 33 (17) (1993) 1132– 1140.

DOI: 10.1002/pen.760331706

[7] J. Jacob, L.H.L. Chin, F.Y.C. Boey, Thermal and non-thermal interaction of microwave radiation with materials, J. Mater. Sci. 30 (1995) 5321–5327.

DOI: 10.1007/bf00351541

[8] C. Nightingale, R.J. Day, Flexural and inter-laminar shear strength properties of carbon fibre/epoxy composites cured thermally and with microwave radiation, Compos. A: Appl. Sci. Manuf. 33 (7) (2002) 1021–1030.

DOI: 10.1016/s1359-835x(02)00031-3

[9] P.L. Mangonon, The Principles of Materials Selection for Engineering Design, Prentice-Hall, New Jersey, 1999.

[10] P.J. Haines, Thermal Methods of Analysis Principles, Applications and Problems, Blackie Academic and Professional, UK, 1995.

[11] D. Hull, Fractography: Observing, Measuring and Interpreting Fracture Surface Topography, The press Syndicate of the University of Cambridge, UK, 1999.

[12] D. Boghdal, P. Penczek, J. Pielichowski and A. Prociak, Microwave assisted sy6nthesis, crosslinking and processing of polymeric materials, Advances in Polymer Sciences, 2003, 163 (2003) 51-58.

DOI: 10.1007/b11051

[13] T. Chaowasakoo and N. Sombatsompop, Mechanical and morphological properties of fly ash/epoxy composites using conventional thermal and microwave curing methods, Composites Science and Technology, 67 (2007), 2282-2291.

DOI: 10.1016/j.compscitech.2007.01.016

[14] T.Tilford, C. Bailey, M.P.Y. Desmulliez, G. Goussettis, A.K. Parrott and A.J. Sangster, Multiphysicis simulation of microwave curing in micro-electronics packaging applications, Soldering and Surface Mount Technology, 19 (2007)

DOI: 10.1108/09540910710843757