Nanoimprint Lithography of Multistep Loading

Le Yan; Lei Yin; Hong Zhong Liu

doi:10.4028/www.scientific.net/AMR.383-390.7214

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 383-390Nanoimprint Lithography of Multistep Loading

Nanoimprint Lithography of Multistep Loading

Abstract:

In this paper, a method of multistep imprint lithography process is described. Through comparing among the loading process factors, a multistep loading locus, which includes a pre-cure release of the pressing force, is proposed for the high-conformity transfer of nano-patterns from the template to the wafer. A series of imprint experiments show that the new multistep loading process can meet the needs for different pressing areas, feature sizes and repetitious imprints. This loading process can effectively reduce the residual resist thickness while maintaining a uniform residual resist and non-distorted transfer of nano-patterns to the resist-coated wafer. And a high-conformity of 100 nm feature can be achieved.

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Periodical:

Advanced Materials Research (Volumes 383-390)

Pages:

7214-7219

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.383-390.7214

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Online since:

November 2011

Authors:

Le Yan, Lei Yin, Hong Zhong Liu

Keywords:

Imprint Lithography, Loading, Pattern Transfer, Process

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