Research on Thermal Conductive and Insulating Material Based on Phosphoric Acid Adhesive

Yong De Hao; Hao Kun Liu; Xuan Xiong

doi:10.4028/www.scientific.net/AMR.399-401.1184

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Drug Release Characteristics of P(AA-co-DMAA)/SA Interpenetrating Polymer Network Hydrogels
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Study on the Perfect Dislocation in Cd_0.9Zn_0.1Te Single Crystals by HRTEM
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Research on Thermal Conductive and Insulating Material Based on Phosphoric Acid Adhesive
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Influence of Lime Dust on Chloride Binding Capacity of Fly Ash-Cement Paste
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 399-401Research on Thermal Conductive and Insulating...

Research on Thermal Conductive and Insulating Material Based on Phosphoric Acid Adhesive

Abstract:

A thermal conductive and insulating material with H₃PO₄ as the adhesive, AlN as the principal material of thermal conduction and Al₂O₃ as auxiliary material, was researched and developed in this paper. The paper explores the influences of components on density, thermal conducting property and dielectric property of the material. Research results show that as to the block sample of (mol)AlN: (mol)Al₂O₃=90:10, ω(H₃PO₄)=12% in the research, its density is 2.51 g/cm³, thermal conductivity is 5.655 W/(m•K), and relative dielectric constant under 10 kHz is 6.207.

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Periodical:

Advanced Materials Research (Volumes 399-401)

Pages:

1184-1187

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.399-401.1184

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Online since:

November 2011

Authors:

Yong De Hao, Hao Kun Liu, Xuan Xiong

Keywords:

Aluminum Substrate, Inorganic Non-Metallic Materials, Insulating Material, Phosphoric Acid Adhesive, Thermal Conductive

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