Study of Micro Droplet Impingement Process of Molten Lead-Free Solder by Inkjet Printing Process

Abstract:

An investigation of molten metal droplet impingement on substrate was conducted. Micro droplets of molten lead-free solder; Sn_3.0wt%Ag_0.5wt%Cu, were ejected at 230°C by using a piezoelectric inkjet printing process. The droplets were squeezed out from nozzle with orifice diameter of 50 µm by applying a voltage pulse of bipolar waveform. In this study, micro droplets with various velocities were deposited onto flat substrate. Spread factors of solders are at the range of 1.23-1.25. With the aid of numerical simulation, interfacial heat transfer coefficients between molten solders and substrate were observed to rise with droplet impact velocity. Though analyzing the data of simulation results, the mathematical relation between interfacial heat transfer coefficient and potential and kinetic energy shows the trend of direct proportion.

• Periodical: Advanced Materials Research (Volume 409)
• Pages: 437-442
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.409.437
• Online since: November 2011
• Authors: Cheng Han Wu, Hsiao Lan Lin, Weng Sing Hwang
• Keywords: Dynamic Pressure, Inkjet Printing, Interfacial Heat-Transfer Coefficient, Lead-Free Solder

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