Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solders

Article Preview

Abstract:

In this paper, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) was incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solder. Up to 0.05% of Ni-CNTs were successfully incorporated. After that, the electrochemical behavior of Sn-Ag-Cu with varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) composite solder were investigated in 0.3% Na2SO4 solution by using potentiodynamic polarization method. Scanning microscopy was used to characterize the samples after the electrochemical tests. It was observed that the corrosion resistance decreased when the content of Ni-CNTs reached a certain level.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 418-420)

Pages:

1171-1174

Citation:

Online since:

December 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] M.N. Islam, Y.C. Chan, M.J. Rizvi, W. Jillek, J Alloy Compd, Vol. 400 (2005) p.136.

Google Scholar

[2] K.M. Kumar, V. Kripesh, L. Shen, K.Y. Zeng, A.A.O. Tay, Mat Sci Eng a-Struct, Vol. 423 (2006) p.57.

Google Scholar

[3] C.Y. Li, G.J. Chiou, J.G. Duh, J. Electron. Mater., Vol. 35 (2006) p.343.

Google Scholar

[4] J. Wei, Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, L.Y. Xu, S.R. Zhang, J Phys D Appl Phys, Vol. 42 (2009).

Google Scholar

[5] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, J Electron Mater, Vol. 39 (2010) p.223.

Google Scholar

[6] J.S. Lee, K.M. Chu, R. Patzelt, D. Manessis, A. Ostmann, D.Y. Jeon, Microelectron. Eng., Vol. 85 (2008) p.1577.

Google Scholar

[7] X.L. Zhong, M. Gupta, Adv. Eng. Mater., Vol. 7 (2005) p.1049.

Google Scholar

[8] X.L. Zhong, M. Gupta, Journal of Physics D-Applied Physics, Vol. 41 (2008) 095403.

Google Scholar

[9] P. Liu, P. Yao, J. Liu, J. Electron. Mater., Vol. 37 (2008) p.874.

Google Scholar

[10] K.M. Kumar, V. Kripesh, A.O. Andrew, J Alloy Compd, Vol. 450 (2008) p.229.

Google Scholar

[11] J. Wei, S.M.L. Nai, M. Gupta, Mat Sci Eng a-Struct, Vol. 423 (2006) p.166.

Google Scholar

[12] U.S. Mohanty, K.L. Lin, J Electrochem Soc, Vol. 153 (2006) B319-B324.

Google Scholar

[13] W. Zhou, N.N. Aung, C.S. Goh, S.M.L. Nai, J. Wei, Corros Sci, Vol. 52 (2010) p.1551.

Google Scholar