Processing and Thermal Conductivity Characterization of Solid Glass Micro-Spheres Filled Polymer Composites

Debasmita Mishra; Alok Satapathy; Amar Patnaik

doi:10.4028/www.scientific.net/AMR.445.526

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 445Processing and Thermal Conductivity...

Processing and Thermal Conductivity Characterization of Solid Glass Micro-Spheres Filled Polymer Composites

Abstract:

This paper describes the preparation and thermal conductivity characterization of solid glass micro-spheres (SGMs) filled polymer composites. SGMs of different sizes are embedded in epoxy resin to develop composites by hand layup technique. A numerical simulation of the heat-transfer within the composites is made by using finite element method (FEM). Three-dimensional spheres-in-cube lattice array models are constructed to simulate the microstructure of composite materials for various SGM content ranging from 0 to about 27 vol % and the effective thermal conductivities (K_eff) of the composites are estimated. K_effvalues are also calculated using some of the existing theoretical models. Finally, guarded heat flow meter test method is used to measure the conductivity of these composites. The simulations are compared with K_eff values obtained from experiments and it is found that the FEM simulations are fairly close to the measured K_eff. This study shows that the incorporation of SGMs results in reduction of conductivity of epoxy resin and thereby improves its thermal insulation capability. Further, the size and content of SGMs influence the extent of reduction of K_eff. Keywords: Composites; Glass Microspheres; FEM; Thermal Conductivity; Simulation

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Periodical:

Advanced Materials Research (Volume 445)

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526-529

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.445.526

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Online since:

January 2012

Authors:

Debasmita Mishra, Alok Satapathy, Amar Patnaik

Keywords:

Composite, Finite Element Method (FEM), Glass Microspheres, Simulation, Thermal Conductivity (TC)

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