Efficient Heat Dissipation Design of High-Power Multi-Chip Cob Package Led Modules

Abstract:

In this study, the junction temperature (T_j) and thermal resistance (R_th) of five high-power multi-chip COB (chip-on-board) LED packages with different chip spacings were compared. The actual T_j was measured by an IR camera and compared with the simulation results from a computational fluid dynamics (CFD) software. In addition, the effects of heat slugs with different thermal conductivity, heat sinks of various thicknesses, chip size, and forced convection cooling on the T_j and R_th of high-powered LED components were investigated. The experimental results show that smaller chip spacing resulted in higher T_j and R_th. The heat dissipation performance can be improved by using a heat slug with a high thermal conductivity; and increasing the thickness of the heat sink, or employing forced convection cooling.

• Periodical: Advanced Materials Research (Volumes 463-464)
• Pages: 1332-1340
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.463-464.1332
• Online since: February 2012
• Authors: Lei Wu, Xiao Yun Xiong, De Xing Wang
• Keywords: Computational Fluid Dynamics (CFD), IR Camera, Junction Temperature, Thermal Resistance

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