Influence of Liquid Structure Change on Microstructure and Properties of SnZnBi Solder Alloy

Abstract:

Currently, Pb-free is the primary trend of development for solder alloys, and the existing Pb-free solder alloys are still difficult to replace the traditional tin-lead solder alloys. How to further improve the welding properties of Pb-free solder alloys is the issue we currently faced. In this paper, through melt overheating treatment, the influence of liquid-liquid structure change (LLSC) on the structure and properties of SnZn8Bi3 Pb-free solder alloy has been studied. Experimental results show that the LLSC has obvious effects on the solidification process and solidified microstructure of SnZn8Bi3 alloy: bigger solidification undercooling degree in the solidification process, finer and more dispersed solidification structure, and more importantly, the mechanical and welding properties of the solder alloy have also been obviously improved.

• Periodical: Advanced Materials Research (Volumes 463-464)
• Pages: 489-493
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.463-464.489
• Online since: February 2012
• Authors: Zhi Hao Chen, Wei Zheng, Fang Qiu Zu, Xie Bing Zhu, Yu Feng Sun
• Keywords: Liquid Structure Change, Melt Structure, Pb-Free Solder

References

[1] F.Q. Zu, Z.G. Zhu, L.J. Guo, et al.: Physical Review B, vol. 64, No. 18 (2001), pp.1-4.

[2] F.Q. Zu, X.F. Li, L.J. Guo, et al.: Physics Letters A, vol. 324 (2004), pp.472-478.

[3] Q. Li, F.Q. Zu, X.F. Li, et al.: Modern Physics Letters B, vol. 20, No. 4 (2006), pp.151-158.

[4] X.F. Li, F.Q. Zu, L.J. Liu, et al.: Physics and Chemistry of liquids, vol. 45, No. 5 (2007), pp.531-539.

[5] F.Q. Zu, Z.G. Zhu, et al.: Physical Review Letters, vol. 89, No. 12 (2002), pp.1-3.

[6] Dahlborg U, Calvo-Dahlborg M, et al.: Eur. Phys. J. B, Vol. 14 (2000), pp.639-648.

[7] X.F. Bian and W.M. Wang: Mater. Lett., Vol. 44 (2000), pp.54-58.

[8] F.Q. Zu, Z.Y. Huang, Z.Z. Wang, et al.: Materials Science in Semiconductor Processing, Vol. 13 (2010), p.86–91.

[9] F.Q. Zu, J. Chen et al.: J. Mater. Res., Vol. 24, No. 7 (2009), pp.2378-2384.

[10] H.S. Chen, F.Q. Zu et al.: SCIENCE IN CHINA (E), Vol. 51, No. 9 (2008), pp.1402-1408.

[11] X.F. Li, F. Zhang, F.Q. Zu, et al.: Journal of Alloys and Compounds, Vol. 505 (2010), p.472–475.

[12] X.F. Li, F.Q. Zu, L.J. Liu, et al.: Journal of Alloys and Compounds, Vol. 453, No. 1-2 (2008), p.508.

[13] H. Richter, G. Breitling: Z. Metallkd., Vol. 61(1970), p.628.

[14] A.C. Mitus, A.Z. Patashinkii, B.I. Shumilo: Phys. Lett., Vol. 41 (1985), p. A113.

[15] V. Manov, P. Popel, et al.: Materials Science and Engineering A, Vol. 304–306 (2001), p.54–60.

[16] A.B. Bhatia W.H. Hargrove: Physical Review B, Vol. 10 (1974), pp.3186-3196.

[17] P.S. Popel, O.A. Chikova, V.M. Matveev: High Temp. Mater. Proc., Vol. 4, No. 4 (1995), p.219.

[18] Hu H Q: The Principle of Metal Solidification. (China Machine Press, Beijing 2000).