Analysis for Replication and Surface Roughness of Micro-Feature of Silicon Mold Insert by UV-LIGA Method

Chiung Fang Huang; Jeol Long Lee; Yung Kang Shen; Chi Wei Wu; Yi Lin; Sung Chih Hsu; Ming Wei Wu; Chung Yu Kao

doi:10.4028/www.scientific.net/AMR.47-50.443

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 47-50Analysis for Replication and Surface Roughness of...

Analysis for Replication and Surface Roughness of Micro-Feature of Silicon Mold Insert by UV-LIGA Method

Abstract:

This study demonstrates the replication property and surface roughness for metal micro-mold that combines the replica molding (REM) and electroforming techniques. The micro-mold firstly uses the silicon wafer to fabricate the master mold by UV-LIGA method, and then uses the sputtering method to sputter the Ni element as the seed layer on the surface of master mold. The electroforming method manufactures the Ni mold insert from the master mold with seed layer. Finally, this study uses the PDMS material to replicate the micro-feature from the Ni mold insert by replica molding. This study indicates the replication property and surface roughness of different micro-feature shapes and sizes (concave and convex) for Ni mold insert and molded PDMS.