Effects of Temperature on Microstructure and Tribological Performance of a-CNx Films Prepared by Pulsed Laser Deposition

Abstract:

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a-CNx films were deposited onto silicon wafers at temperatures from RT up to 600 °C by using pulsed KrF excimer laser deposition. The composition, morphology and microstructure of the CNx films were characterized by X-ray photoelectron spectrum (XPS), scanning electron microscopy (SEM) and Raman spectrum. The tribological performance of the films was investigated using a ball-on-disk tribometer. With increasing the deposition temperature ranging from RT to 400 °C, the N content of films dropped from 36 at.% to 22 at.%, the ratio of N-sp3 C bonds, hardness and friction coefficient of the film decreased. Further increase of deposition temperature led to the lack of nitrogen and the increasing degree of order in ringed sp2 C=C bonds of the amorphous carbon film. The mechanical and tribological performances became worse. The film deposited at 300°C showed a low friction coefficient of 0.11 and a preferable wear resistance of 1.65×10–7 mm3 Nm–1 in humid air.

Info:

Periodical:

Advanced Materials Research (Volumes 47-50)

Edited by:

Alan K.T. Lau, J. Lu, Vijay K. Varadan, F.K. Chang, J.P. Tu and P.M. Lam

Pages:

549-553

DOI:

10.4028/www.scientific.net/AMR.47-50.549

Citation:

X.H. Zheng et al., "Effects of Temperature on Microstructure and Tribological Performance of a-CNx Films Prepared by Pulsed Laser Deposition", Advanced Materials Research, Vols. 47-50, pp. 549-553, 2008

Online since:

June 2008

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$35.00

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