Study on the Dielectric Properties of Hybrid and Porous Polyimide-Silica Films

Abstract:

Article Preview

A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1µm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.

Info:

Periodical:

Advanced Materials Research (Volumes 47-50)

Edited by:

Alan K.T. Lau, J. Lu, Vijay K. Varadan, F.K. Chang, J.P. Tu and P.M. Lam

Pages:

973-976

DOI:

10.4028/www.scientific.net/AMR.47-50.973

Citation:

Y. H. Zhang et al., "Study on the Dielectric Properties of Hybrid and Porous Polyimide-Silica Films", Advanced Materials Research, Vols. 47-50, pp. 973-976, 2008

Online since:

June 2008

Export:

Price:

$35.00

In order to see related information, you need to Login.