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Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die

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Abstract:

Based on the parallel bonding mechanism of IC chip die designed, the static stiffness model is established. Static stiffness characteristic curves are drawn in whole working place through Matlab software, the infection which created by the left/right driving parts and connecting rods are analyzed. It proves that the parallel bonding mechanism designed meets the working requirements of IC chip die by these characteristic curves.

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Periodical:

Advanced Materials Research (Volumes 490-495)

Pages:

3531-3535

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.490-495.3531

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Cite this paper

Online since:

March 2012

Authors:

Wei Dong Peng, Zhi Wei Wu

Keywords:

Characteristic Curves, Parallel Bonding Mechanism, Static Stiffness, Stiffness Matrix

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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