Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die

Abstract:

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Based on the parallel bonding mechanism of IC chip die designed, the static stiffness model is established. Static stiffness characteristic curves are drawn in whole working place through Matlab software, the infection which created by the left/right driving parts and connecting rods are analyzed. It proves that the parallel bonding mechanism designed meets the working requirements of IC chip die by these characteristic curves.

Info:

Periodical:

Advanced Materials Research (Volumes 490-495)

Edited by:

Ran Chen and Wen-Pei Sung

Pages:

3531-3535

DOI:

10.4028/www.scientific.net/AMR.490-495.3531

Citation:

W. D. Peng and Z. W. Wu, "Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die", Advanced Materials Research, Vols. 490-495, pp. 3531-3535, 2012

Online since:

March 2012

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Price:

$35.00

[1] Li Ketian, Chen Xin, Wu Xiaohong : China Engineering China Mechanical Engineering Vol. 16 (2005), pp.54-56.

[2] Steward D. A : Proc Inst Mech Engrs Vol. 15 (1966), pp.371-386.

[3] Chen Jiqing, Lan Fengchong : Mechanical Science and Technology Vol. 25(2006), p . 479-483.

[4] Zhou Yulin, Gao Feng : Journal of Mechanical Engineering Vol. 45(2009), pp.25-32.

[5] Li Hui, Zhu wenbai : Journal of Mechanical Engineering Vol. 3(2010), pp.8-16.

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