Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die
Based on the parallel bonding mechanism of IC chip die designed, the static stiffness model is established. Static stiffness characteristic curves are drawn in whole working place through Matlab software, the infection which created by the left/right driving parts and connecting rods are analyzed. It proves that the parallel bonding mechanism designed meets the working requirements of IC chip die by these characteristic curves.
Ran Chen and Wen-Pei Sung
W. D. Peng and Z. W. Wu, "Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die", Advanced Materials Research, Vols. 490-495, pp. 3531-3535, 2012