Study on Groove Shape of CMP Polishing Pad: A Review

Abstract:

In the chemical mechanical polishing process (CMP) ，the groove shape of polishing pad is one of the most critical elements that directly influences the quality and efficiency of CMP. This review paper describes the basic patterns of groove shape and that the patterns shape of polishing pad how to effect on quality and efficiency of CMP. The effect comparison between various sorts of groove shape and their effects on polishing is described. It is intended to help reader to gain a more comprehensive view on groove shape of polishing pad, and to be instrumental for research and development new groove shape of polishing pad for CMP.

• Periodical: Advanced Materials Research (Volume 497)
• Pages: 278-283
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.497.278
• Online since: April 2012
• Authors: Chun Lan Lou, Hai Yan Di, Qiang Fang, Tao Kong, Wei Feng Yao, Zhao Zhong Zhou
• Keywords: Chemical Mechanical Polishing (CMP), Groove Shape, Polishing Pad

References

[1] X. Wei, W. Xiong, R.W. Huang: Diamod ＆ Abrasives Engineering, No. 5 (2004), p.40.

[2] Information on http: /www. electronchem. org/meetiongs/scheduler/absttracts/210/1150. pdf.

[3] H. Zhou, D.P. Wang, B. Wang, X.F. Chen, Y.X. Ye: Mechanical Engineering ＆ Automation No. 6 (2008), p.73.

[4] W. Hu, X. Wei, X.Z. Xie: Manufacturing Technology ＆ Machine Tool No. 1 (2008), p.77.

[5] B. Liu: Study on the Effects of the Surface Texture and Constituent of the Pad in CMP [D]. Da Lian: Da Lian university of technology(2006).

[6] W. Xiong: Study on the performance of polishing pad in chemical-mechanical polishing [D]. Guangdong: Guodong University of Technology, (2006).

[7] P. Gregory, U.S. Patent 7018274 (2006).

[8] L. Carolina, D. Elmuf, P. Gregory, U. S . Patent 7267610 (2007).

[9] P. Gregory, U. S . Patent 6974372 (2005).

[10] K. Toshiroh, S. Kiyoshi, S. Keisuke, et al: Journal of The Electrochemical Society Vol. 15 No. 3(2004), p.196.

[11] D. Rosales-Yeomans, T. Doi, M. Kinoshita, et al: Journal of The Electrochemical Society Vol. 152 No. 1(2005), p.62.

[12] B. Len, C. Leslie: Journal of The Electrochemical Society Vol. 151 No. 12(2004), p.809.

[13] H. Thomas, H. Osterheld,C. Chih, R. Erik, U.S. Patent 6241596 (2001).

[14] P. Gregory, U. S . Patent 7125318(2006).

[15] P. Gregory, U.S. Patent 7059950(2006).

[16] P. Gregory, U.S. Patent 7311590(2007).

[17] P. Gregory, U.S. Patent 7520796(2009).

[18] L. Carolina, P. Gregory, U.S. Patent 7059949(2006).

[19] SKC CO. ，LTD, W.O. Patent 03/017347(2003).

[20] L. Carolina, J. Jeffrey, P. Gregory, U.S. Patent 7131895(2006).

[21] P. Gregory, U.S. Patent 6783436(2004).

[22] V. Ravichandra, U.S. Patent 6958002(2005).

[23] A. Peter, J. Bradley, U. S . Patent 5645496(1997).

[24] L. Carolina, V. Ravichandra, U. S . Patent 7270595(2007).