A New Method for Measuring the Thickness of Tin Coating Layer on the Mobile Phone Case

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Abstract:

The Tin coating thickness has significant influence on the quality of the mobile phone case product. It is very difficult to obtain the Tin coating thickness using conventional testing method. This paper proposes a new technique for efficient and accurate measuring the Tin thickness plated on the surface of mobile phone case products through analyzing the section image of the product derived from SEM. A computer image analysis has been carried out to obtain the thickness of the Tin coating. In the paper, we describe the detailed sample preparing processes which involve the use of rubber container, clamp, PS resin, firming agent, polishing machine, 3000 mesh sanding paper, silk, SEM and other tooling, scanning the sample section with SEM to obtain the image in computer and analyzing the image in the computer. This new method is very efficient and quite accurate, thus can be used in the production line to monitor the Tin coating thickness to help control the product quality.

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Periodical:

Advanced Materials Research (Volumes 503-504)

Pages:

1288-1291

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Online since:

April 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] Jingli Fang: A new process of replacement Sn plating for PCB with TI-1 additive, Electroplating & Finishing Vol. 2 (2004), pp.36-42, in Chinese.

Google Scholar

[2] Ruidong Xu: Analysis of Components, Surface Morphologies and Structure of Tin Coating, Surface technology Vol. 6 (2002), pp.65-67, in Chinese.

Google Scholar

[3] Guochun Zhang: Detection of Tin thickness of tinned steel wire, Physical Testing and Chemical Analysis Part A (Physical Testing) Vol. 8 (1999), pp.357-359, in Chinese.

Google Scholar

[4] X.L. Ge,C.W. Wang ,Z.C. Chen et. al.: Key Engineering Materials Vol. 464 (2011), pp.514-517.

Google Scholar