Development of an Embedded High-Temperature Field Measuring Instrument

Abstract:

This paper describes the development of an embedded high-temperature measuring instrument, which is composed of lens, photoelectric converter based on area-array CCD, and data acquisition, processing, Ethernet communication module based on DSP. The device is a creation of imaging spectrum, CCD imaging technology, digital image processing method and Ethernet communication together effectively. The advantages of this approach are: First, the networked measuring platform provides the possibility for process parameters optimization. Second, direct digital signal communication improves the anti-interference ability. Third, by employing 4-stage pipeline data processing mechanism greatly improves the real-time requirement. Fourth, through the constitution of application-layer protocol, the reliability of high-speed data transmission via Ethernet is guaranteed. The experiment by blackbody furnace in the laboratory shows that the maximum absolute error is 3.2 ^ºC, and the maximum relative error is 0.40%.

• Periodical: Advanced Materials Research (Volume 508)
• Pages: 151-154
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.508.151
• Online since: April 2012
• Authors: Hai Cheng Bai, Hong Ji Meng, Zhi Xie
• Keywords: Area Array CCD, Data Acquisition, Digital Signal Processor (DSP), Image Processing, Networked Temperature Detection

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