Effect of Loading Rates on the Nominal Bonding Strength between Soft Substrate and Photovoltaic Silicon Wafer

Guo Ning Liu; Hua Dong Zhao; Wei Yang; Sheng Gang Ma; Ming Hao Zhao

doi:10.4028/www.scientific.net/AMR.512-515.51

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 512-515Effect of Loading Rates on the Nominal Bonding...

Effect of Loading Rates on the Nominal Bonding Strength between Soft Substrate and Photovoltaic Silicon Wafer

Abstract:

Aiming at expanding and extending the application of photovoltaic energy technology into a bigger scope, a kind of soft substrate with multilayer structure is designed and fabricated to be bonded with photovoltaic silicon wafer to manufacture photovoltaic system. Pure aluminum thin film is introduced in the designed structure, which consists of mainly organic polymeric materials, to improve the thermal conducting behavior and anti-corrosion properties of the whole photovoltaic system. To study the reliability of the eventual structure with photovoltaic module of silicon wafer, various loading rates are chosen to measure the nominal bonding strength between the soft substrate and photovoltaic module.

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Periodical:

Advanced Materials Research (Volumes 512-515)

Pages:

51-54

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.512-515.51

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Online since:

May 2012

Authors:

Guo Ning Liu, Hua Dong Zhao, Wei Yang, Sheng Gang Ma, Ming Hao Zhao

Keywords:

Aluminum Thin Film, Bonding, Loading Rate, Photovoltaic (PV), Soft Substrate

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