Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect

Qiu Sheng Yan; Ai Jun Tang; Jia Bin Lu; Wei Qiang Gao

doi:10.4028/www.scientific.net/AMR.53-54.155

Paper Titles

Research on Mechanism of Chemical Mechanical Polishing Process for Silicon Nitride Balls with CeO₂ Abrasive
p.131

Polishing Processing to Internal Surface of Non-Magnetic Pipe by Magnetic Abrasive Finishing
p.137

Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy Films
p.141

Study on the Evaluation Method of Lapping Uniformity for Ceramic Balls
p.147

Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect
p.155

Experimental Validation of the ‘Trap’ Effect of the Semibonded Abrasive Grinding Plate
p.161

Effect of Ice Counterparts on the Friction Behavior of Single Crystal Silicon Wafer
p.167

Machining Characteristics of Semibonded Abrasive Grinding Plate
p.173

The Analysis for Materials Removal Mechanism of Ultrasonic Auxiliary Gear Honing
p.179

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 53-54Development of a New Plate Polishing Technique...

Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect

Abstract:

A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented in this paper, and some experiments were conducted to prove its effectiveness and applicability. Under certain experimental condition, the material removal rate was improved by a factor of 20.84% as compared with the conventional polishing methods with dissociative abrasive particles, while the surface roughness of the workpiece was not obviously increased. Furthermore, the composite of the MR fluid was optimized to obtain the best polishing performance. On the basis of the experimental results, the material removal model of the new plate polishing technique was presented.