Effect of Al on Zn-Al Filler Metal Wettability on Pure Copper Surface

Abstract:

Zn-Al filler metal wettability tests were performed. With the match of CsF-AlF3 flux, Zn-Al filler metal wettability is poor on pure copper surface. The Cu-Al-Zn intermetallic compound interface layer exits between Zn-Al filler metal and Cu base metal. When Al content is low in Zn-Al filler metal, the filler metal wettability is poor and the filler metal melting point is low. In the wettability test course, the time is long in which Cu base metal interacts with liquid Zn-Al filler metal. And the Cu-Al-Zn intermetallic compound interface layer grows thick between filler metal and base metal. With the increase of Al content in Zn-Al filler metal, the interaction strengthens between Zn-Al filler metal and Cu base metal. In the wettability test course, the time beocome short in which Cu base metal interacts with liquid Zn-Al filler metal. The Cu-Al-Zn intermetallic compound interface layer gets thin between filler metal and base metal. Meanwhile, Zn-Al filler metal wettability improves on pure copper surface. But the improvement is not remarkable. Its wettablility is still poor on pure copper surface.

• Periodical: Advanced Materials Research (Volumes 538-541)
• Pages: 196-199
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.538-541.196
• Online since: June 2012
• Authors: Man Zhang, Yue Bin Lin, Jian Qiang Lv, Hai Lin Jiang
• Keywords: Pure Copper, Wettability, Zn-Al Filler Metal

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