The Characteristics of High-Speed Cylindrical Grinding of Silicon Carbide and its Influence on the Surface Layer

Jia Ming Ni; Bei Zhi Li; Jing Zhu Pang

doi:10.4028/www.scientific.net/AMR.565.123

Paper Titles

Accurate Extraction of Normal Residual Error for Compensation Grinding
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Grinding Performance Evaluation of the Developed Chemo-Mechanical Grinding (CMG) Tools for Sapphire Substrate
p.105

A Grinding Protocol for the Fabrication of Micro/Meso Aspheric Moulds for Optic Applications
p.111

Industrial Application of the MCG (Minimum Coolant Grinding) Technology
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The Characteristics of High-Speed Cylindrical Grinding of Silicon Carbide and its Influence on the Surface Layer
p.123

An Experimental Investigation of Ultrasonic Assisted Grinding in DOE Approach
p.129

Design of Ultrasonic Horn for Grinding Using Finite Element Method
p.135

Experimental Investigation on Ultrasonic Assisted Grinding of High Volume Fraction SiC Particles Reinforced Al Matrix Composites
p.142

Effects of Ultrasonic Frequencies on Grinding Force of Nano-Composite Ceramics Based on Nonlocal Theory
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 565The Characteristics of High-Speed Cylindrical...

The Characteristics of High-Speed Cylindrical Grinding of Silicon Carbide and its Influence on the Surface Layer

Abstract:

There has been increased interest in the use of advanced ceramic materials such as silicon carbide in the recent past, due to its unique physical and mechanical properties. However, the increase of the machining rate relies on the understanding of material removal mechanism on the microstructural scale and the relationship between the grinding characteristics and formation of surface/subsurface machining-induced damage. In this paper, grinding characteristics and surface integrity of SiC ground with diamond wheel on cylindrical grinding machine have been investigated. The grinding chip and the ground surface damage have been studied with scanning electron microscope (SEM). In particular the residual stress distribution has been analyzed by a single exposure technique d - sin2 (Ψ) method with the aid of powder X-ray diffractometer.

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Periodical:

Advanced Materials Research (Volume 565)

Pages:

123-128

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.565.123

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Online since:

September 2012

Authors:

Jia Ming Ni, Bei Zhi Li, Jing Zhu Pang

Keywords:

Ceramic, High-Speed Grinding, Silicon Carbide (SiC), Surface Integrity

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References

[1] H. Salmang, H. Scholze: Keramik: Teil 1 und 2. Springer-Verlag, Berlin, 6. Auflage, (1983).

Google Scholar

[2] E. Verlemann: Prozeßgestaltung beim Hochgeschwindigkeits-außenrundschleifen von Ingenieur- keramik. PhD Thesis, RWTH Aachen University, (1994).

Google Scholar

[3] F. Klocke, et al: CIRP Annals - Manufacturing Technology, Vol. 46, Issue 2 (1997), pp.715-724.

Google Scholar

[4] I. Inasaki: CIRP Annals - Manufacturing Technology. Vol. 36, Issue 2 (1987), pp.463-471.

Google Scholar

[5] R.P. Goehner, et al: Powder Diffraction. Vol. 7, Issue 1(1992), pp.2-5.

Google Scholar

[6] B.D. Cullity: Elements of X-ray Diffraction, Addison-Wesley Publishing Company, Inc. (1978).

Google Scholar

[7] T.W. Hwang, et al: Journal of Manufacturing Science and Engineering. Vol. 122 (2000), pp.32-41.

Google Scholar

[8] S. Malkin: Grinding Technology: Theory and application of machining with abrasives, Chichester: Ellis Horwood, (1989).

Google Scholar

[9] H. Huang, et al: Journal of Materials Processing Technology. Vol. 141 (2003), p.329–336.

Google Scholar

[10] S. Malkin et al: Annals CIRP, Vol. 45, Issue 2 (1966), p.569–580.

Google Scholar