Slurry Flow Visualisation of Chemical Mechanical Polishing Based on a Computational Fluid Dynamics Model

Y.B. Tian; S.T. Lai; Z.W. Zhong

doi:10.4028/www.scientific.net/AMR.565.324

Paper Titles

Effect of Fabrication Conditions on Ultra-Fine Abrasive Polishing Pad
p.302

A New Automatic Backlash Adjustment Method for Lapping of Spiral Bevel Gear
p.307

Kinematics Simulation of Eccentric Dual Rotated-Plates Lapping for Bearing Balls
p.312

Research on the Workpiece Kinematics in Face Lapping with Friction Drive
p.318

Slurry Flow Visualisation of Chemical Mechanical Polishing Based on a Computational Fluid Dynamics Model
p.324

Simulation of CMP Process Based on Mixed Elastohydrodynamic Lubrication Model with Layered Elastic Theory
p.330

An Experimental Study of the Abrasive Water Jet Micro-Machining Process for Quartz Crystals
p.339

A 3D Simulation on Fluid Field at the Impact Zone of Abrasive Water Jet under Different Impact Angles
p.345

The Effect of Abrasive Water Jet Process Variables on Surface and Subsurface Condition of Inconel 718
p.351

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 565Slurry Flow Visualisation of Chemical Mechanical...

Slurry Flow Visualisation of Chemical Mechanical Polishing Based on a Computational Fluid Dynamics Model

Abstract:

In this work, we developed a computational fluid dynamics (CFD) model to simulate the slurry flow between the wafers and pad during the chemical mechanical polishing (CMP) process under a multiple-wafer configuration. A serial of simulations were carried out to visualise slurry flow and explore the effects of the process variables concerned on the flow velocity and pressure distributions beneath the wafers. Through the model and simulation, the flow field characteristics were obtained and analyzed under different operating conditions. The results can provide an insight into a fundamental understanding of the slurry flow behaviours under the multiple-wafer configuration and some useful implications for the selection of practical polishing variables.

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Periodical:

Advanced Materials Research (Volume 565)

Pages:

324-329

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.565.324

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Online since:

September 2012

Authors:

Y.B. Tian, S.T. Lai, Z.W. Zhong

Keywords:

CMP, Computational Fluid Dynamics (CFD), Polishing Pad, Slurry Flow Visualisation

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