Atomic-Scale Grooving on Copper: End-Milling vs. Peripheral-Milling

D.D. Cui; Kausala Mylvaganam; Liang Chi Zhang

doi:10.4028/www.scientific.net/AMR.565.546

Paper Titles

Study on Fine Groove Milling of Microchannel Dies – Tool Bending in Milling of Micro-Grooves
p.523

Effect of Different Dielectric Fluids on Micro EDM of Low Conductivity Ceramic Material RB-SiC
p.529

A Processing Technical Analysis for the Characteristics of Forces and Surface Roughness in Micro-Scale Milling
p.535

Experimental Study on Cutting Performance in Micro-Grinding Hard Brittle Materials
p.541

Atomic-Scale Grooving on Copper: End-Milling vs. Peripheral-Milling
p.546

Micro Milling for Polymer Materials Used in Prototyping of Microfluidic Chip Application
p.552

An Experimental Study of the Effect of Cutting Parameters on Micro Milling Process
p.558

Mechanical Properties and Deformation of LiTaO₃ Single Crystals Characterised by Nanoindentation and Nanoscratch
p.564

Determination of the Minimum Depth of Cut in Nanometric Machining Using Molecular Dynamics Simulation
p.570

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 565Atomic-Scale Grooving on Copper: End-Milling vs....

Atomic-Scale Grooving on Copper: End-Milling vs. Peripheral-Milling

Abstract:

This paper investigates the high speed nano-grooving on mono-crystalline copper by nano-end-milling and nano-peripheral-milling. The molecular dynamics method was used for simulation. The milling forces and grooving quality were analysed in detail. The comparison showed that peripheral-milling requires a higher force, but the milled groove has a better quality. Nevertheless, both the milled groove subsurfaces are free of major dislocations.