Fabrication of Pb-Free Sn-Bi Solder Using Polyoxyethylene Lauryl Ether

Abstract:

Lead-free solders have been gaining more and more attention recently. Sn-Bi system is one of the most promising candidates as the lead-free solder materials. In this article Polyoxyethylene lauryl ether (Brij 35) was used as the additive in the electrochemical deposition of Sn-Bi alloy. Various current densities and bath compositions have been investigated. Sn-Bi composites were successfully deposited on a copper substrate. The deposits were then characterized and studied by scanning electron microscopic (SEM), energy dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD) and differential scanning calorimeter (DSC). Results indicate that the morphology and crystalline orientations are composition dependent. Intermetallic compound (IMC) was formed during the reflow process.

• Periodical: Advanced Materials Research (Volume 569)
• Pages: 159-163
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.569.159
• Online since: September 2012
• Authors: Sheng Hong Zhang, Quan Fang Chen
• Keywords: Electrochemical Deposition, Polyoxyethylene Lauryl Ether, Sn-Bi Alloy

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