Preface, Conference Organizers and Sponsoring Organizers
Enhancement of through Silicon via Sidewall Quality by Nanosecond Laser Pulses with Chemical Etching Process
p.3
p.3
High Efficiency LED Module with 3D Bending Machine
p.10
p.10
Superplastic Forming Characteristics of a Fine-Grained Cu-Based Shape Memory Alloy
p.22
p.22
Application of FEM Simulation and Abductive Network to Predict the Springback of U-Shaped Bending Process with Counter Force
p.32
p.32
FEM Simulation Comparisons of Backward Extrusion
p.42
p.42
Flaw Classification of Flexible Copper Clad-Laminated Sheet
p.52
p.52
Analysis of Wear Behaviour of Sintering Carbide against DLC Coated and Nitriding Steel
p.60
p.60
General Solution to Bond Rolling of Unbounded Sandwich Sheet with Outer Soft and Inner Hard Layers Considering Coulomb Friction
p.68
p.68
Preface, Conference Organizers and Sponsoring Organizers
Abstract:
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Info:
Periodical:
Advanced Materials Research (Volume 579)
Online since:
October 2012
Сopyright:
© 2012 Trans Tech Publications Ltd. All Rights Reserved
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