Study on Manufacturing Technology of Resin Bonded Diamond Wire Saw

Abstract:

Slicing of silicon, quartz crystal and other hard brittle materials mainly use dissociated abrasive multi-wire saw slicing technology, which exists some shortcomings, such as severe environmental pollution, lower cutting efficiency, etc. So it is bound to be replaced by fixed abrasive diamond wire saw in the future. At present, generally, the manufacturing technology of fixed diamond wire saw includes electroplating method and resin bonded method. Compared with electroplating diamond wire saw, the resin bonded diamond wire saw has obvious advantages, such as simpler production technique, lower cost, higher cutting efficiency, less environmental pollution, etc. In this paper, the polyurethane was chosen as matrix resin of resin bonded, and phenolic resin was chosen as curing agent, the preparation technology of thermosetting resin bonded diamond wire saw, is researched in this paper. Firstly, the effects of various compositions on resin bonded, are researched, then the optimal fomula and the manufacturing technology are determined

• Periodical: Advanced Materials Research (Volumes 602-604)
• Pages: 2054-2058
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.602-604.2054
• Online since: December 2012
• Authors: Dong Mei Xu, Hai Bo Zhang, Jun Gao, Ming Hui Cong
• Keywords: Diamond Abrasives, Diamond Wire Saw, Manufacturing Technology, Resin Bonded

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