Application of Speed Observer for XY-Stage of Wire Bonder

Abstract:

Wire bonder is important equipment in semiconductor post-packaging. In this paper, a speed observer is applied in the motion control system for XY-stage of wire bonder. A simplified friction model is introduced in the observer to take place of traditional friction compensator. With the introduced manual tuning steps, the model can be easily and exactly identified. The compensator of observer is designed by pole placement. As experiments results showing, high motion speed and acceleration of XY-stage is achieved by applying the introduced control structure. The efficiency of wire bonding process is significantly improved.

• Periodical: Advanced Materials Research (Volumes 655-657)
• Pages: 1342-1347
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.655-657.1342
• Online since: January 2013
• Authors: Lei Zhou, Jian Gang Li, Wen Nong Zhang, Ze Xiang Li
• Keywords: Friction Model, High-Speed, Identification, Speed Observer, Wire Bonder, XY-Stage

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