The Application of New Reagent in the Copper Wiring CMP

Juan Wang; Xin Huan Niu; Xia Jiang; Yu Ling Liu

doi:10.4028/www.scientific.net/AMR.655-657.1547

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 655-657The Application of New Reagent in the Copper...

The Application of New Reagent in the Copper Wiring CMP

Abstract:

At present there are many challenges in the acidity slurry used widely. And the toxic BTA with side effect must be used in the international. So the component of slurry must be improved. The new reagent is studied. It makes the slurry alkalization. It also has the using as a pH adjusting agent, complexion agent of copper ion, multi- metal chelating agents, aminating agent of acidic oxides, pH buffer, stainless steel corrosion inhibitor, the active agent and pro-oxidant. It improves the property of slurry and solves many different of acidity slurry. The alkalinity slurry contained the multi-hydroxyl polyamines is environmental、inexpensive and composition- simplified. The slurry with it can achieve the high speed and high flat. In the same time the low pressure and the little abrasive can be realized, which provide the new material for the removal of copper film.

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Periodical:

Advanced Materials Research (Volumes 655-657)

Pages:

1547-1549

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.655-657.1547

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Online since:

January 2013

Authors:

Juan Wang, Xin Huan Niu, Xia Jiang, Yu Ling Liu

Keywords:

CMP, Copper Wiring, New Reagent

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