Direct and Indirect Strain Measurement of Flexible Printed Circuit Boards - fPCBs

Luciano Arruda; Cristiano Coimbra; João Marco Andolfatto

doi:10.4028/www.scientific.net/AMR.655-657.88

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 655-657Direct and Indirect Strain Measurement of Flexible...

Direct and Indirect Strain Measurement of Flexible Printed Circuit Boards - fPCBs

Abstract:

This work is related to reliability of strain measurement in flexible printed circuit boards (fPCBs) made with polyimide substrate. It was observed that the fPCBs are very sensitive to strain mounting stiffness. The indirect measurement method will be done employing High Speed Camera (HSP). The direct method will be formulated in two ways: 1) conventional strain gauge glued in an fPCBs; 2) printed strain gauge in a polyimide substrate. This paper will point out mistakes and show advantages when using different method to extract the deformation field of the selected area in a flexible thin film.

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Periodical:

Advanced Materials Research (Volumes 655-657)

Pages:

88-93

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.655-657.88

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Online since:

January 2013

Authors:

Luciano Arruda, Cristiano Coimbra, João Marco Andolfatto

Keywords:

Finite Element Analysis (FEA), Flexible Circuits Board, FR4, High Speed Camera, Microelectronics, Polyimide, Printed Circuits, Reliability, Strain Gage, Thin Film

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References

[1] Arruda L., On the Simulation of Flexible Circuits Boards, EMPC2007 6th European Microelectronics and Packaging Conference, Oulu, Finland, June 17 – June 20, pp.984-989, (2007).

Google Scholar

[2] Coombs' Jr, Clyde F., Coombs' Printed Circuits Handbook, McGraw Hill (2001), p.56. 3 – 56. 6.

Google Scholar

[3] Bonadiman, R., Marques, M., Freitas, G. and Reinikainen, T., 2008, Evaluation of Printing Parameters and Substrate Treatmet Over the Quality of Printed Silver Traces, Proceedings of the 2nd Electronics Systemintegration Technology Conference, Greenwich, United Kindom, pp.1343-1348.

DOI: 10.1109/estc.2008.4684550

Google Scholar

[4] Edson Silva, Oliveira, W.C., Arruda, L. O., Quintero, Jairo, Mancosu, R., Silva Neto, J.M. Finite Element Simulation of Inkjet Printed Strain Gage on Polyimide Substrates Applied to Flexible Boards,. In: 10th Electronics Packaging Technology Conference, Proceedings of EPTC 2009, Singapore.

DOI: 10.1109/eptc.2009.5416476

Google Scholar

[5] FHOTRON, FASTCAM-512PCI User's Manual Ver3. 0 Revision 1. 01E International Version,. USA, (2003).

Google Scholar

[6] ANSYS, Electronics Manual, Version 11. 0. USA, (2008).

Google Scholar