Some Noteworthy Aspects in Designing High-Speed PCB

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Abstract:

With the increase of integrated circuit switch rate and PCB density, signal integrity has become one of the problems must be concerned in high-speed PCB design. How to fully consider EMC (Electromagnetic compatibility) and take effective measures has been a key factor of a system design. Based on the consideration of EMC, the author put forward some aspects in designing high-speed PCB. The optimized PCB design rules have steady and credible performance, the development period is shortened and the cost is reduced. The conclusions drawn from the dissertation are helpful to the design of high-speed PCB.

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846-850

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February 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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[1] Lynne Green. Understanding the Importance of Signal Integrity. CIRCUITS&DEVICES, 1999, No. 11: 7-10.

Google Scholar

[2] Ravender Goyal. Managing signal integrity. IEEE SPECTRUM, 1994, No. 3: 54-58.

Google Scholar

[3] Stephen H. HallMcCall High-Speed Digital System Design-A Handbook of Interconnect Theory and Design Practices. New York:John Wile&Sons, Inc, 2000: 65-123.

Google Scholar

[4] How ared W. Johnson, Martin Graham. High-Speed Digital Design. A Handbook of Black Magic. New Jersey: Prentice Hall PTR, (1993).

Google Scholar

[5] Ross. B. IBIS models for signal integrity applications. Electrical Engineering Times. 1996, No. 2.

Google Scholar

[6] Mark I Montrose. Printed Circuit Board Design Techiques for EMC Compliance . IEEE Press, (1996).

Google Scholar

[7] R.L. Khan, G.I. Costache. Consideration on modeling crosstalk on printed circuit boards. IEEE 1987 Int: 279-281.

Google Scholar