Joining Active Metals with Al2O3 by Use of Solders

Roman Koleňák; Michal Prach

doi:10.4028/www.scientific.net/AMR.664.667

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 664Joining Active Metals with Al2O3 by Use of Solders

Joining Active Metals with Al₂O₃ by Use of Solders

Abstract:

The work deals with joining active metals as Ti, Zr and Hf with Al₂O₃ ceramics. The solubility of these active metals in selected Sn and In based solders was studied at a selected soldering temperature. Capability of active metals to wet Al₂O₃ ceramics and to form a diffusion bind was ascertained. Soldering was performed with Sn, Sn5Ag, In and In30Sn solders, which were enriched by an active element from metallic substrate of the joint in soldering process. Soldering temperature in vacuum varied from 770 to 870 °C and soldering time was selected from 8 to 20 min. It was found out that the most suitable metal for active solders is Ti, because it is dissolved in Sn solder already at temperature 780 °C. Wetting of ceramic Al₂O₃ substrate and formation of a diffusion bond was achieved already at temperature 830 °C/8 min. Diffusion bond with Zr was formed just at temperature 870 °C/20 min. and it was impossible to form a diffusion bond with Hf.

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Periodical:

Advanced Materials Research (Volume 664)

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667-671

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.664.667

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Online since:

February 2013

Authors:

Roman Koleňák, Michal Prach

Keywords:

Active Metals Ti, Active Solder, Al₂O₃ Ceramics, HF, Zr

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