Interface Constraint Effect and Stress Relaxation in Nano-Sandwiched Thin Film

Abstract:

Micro-particles and nano-wires, small outgrowths were found to appear on upper film surface when metal thin film is confined between two Si3N4 layers deposited by magnetron sputtering and is annealed at an appropriate temperature. The stress evolution during this process is monitored by multi-beam optic stress sensor, and is qualitatively interpreted in terms of elastic and plastic deformation, as well as bulk diffusion. Additionally, the interface constraint effect among different layers is explored. Stress relaxation of nano-sandwiched thin films behaves in different stress modes. As a comparative study, Si3N4/Zn/Si3N4 sandwiches were prepared and studied by the same method. Experimental results show that the pertinent geometry is strongly dependent on material types and stress states of the substrates. Finally, an appropriate mode was suggested to interpret this phenomenon.

• Periodical: Advanced Materials Research (Volume 669)
• Pages: 154-160
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.669.154
• Online since: March 2013
• Authors: Geng Rong Chang, Fei Ma, Da Yan Ma, Ke Wei Xu
• Keywords: Interface Constraint, Micro-Particles, Nano-Sandwiched Thin Film, Nano-Wire, Stress Relaxation

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