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Preparation and Properties of Conductive Epoxy Resin Composites

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Abstract:

The conductive adhesives were prepared by using micron silver, ball-milled silver and the mixture of them as conductive fillers, respectively, and epoxy resin as matrix. In this study, The relationship between the resistivity with the content of silver fillers was tested. With the micron sliver loading from 60 wt% to 75 wt%, the resistivity decreases significantly about 8 orders of magnitude. And the effects of the different types of silver fillers (micron silver, ball-milled silver and the mixture of them) on the resistivity were also investigated. The study shows that the ECAs filled with the micron sliver gets the highest resistivity and the resistivity of ECAs which uses the ball-milled sliver as fillers is the lowest.

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Periodical:

Advanced Materials Research (Volume 669)

Pages:

171-175

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.669.171

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Online since:

March 2013

Authors:

Xin Ding, Hua Wang, Xing You Tian, Kang Zheng

Keywords:

Ball-Milled Sliver, Conductive Adhesive, Micron Sliver, Resistivity

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] H. Zhao, T. Liang and B. Liu, J. Adhes. 27 (2007) 429-433.

Google Scholar

[2] J.C. Jagt, IEEE Trans. Components, Packaging and Manufacturing Technology Part A. 21 (1998) 215.

Google Scholar

[3] Y. Li, K.S. Moon, and C.P. Wong, J. Sci. 308 (2005) 1419-1420.

Google Scholar

[4] H.J. Jiang, K.S. Moon, J.X. Lu and C.P. Wong, J. Electron. Mater. 34 (2005) 1432-1439.

Google Scholar

[5] C.T. Murray, R.L. Rudman, M.B. Sabade and A.V. Pocius, J. Mater. Res. Bull. 28 (2003) 449-454.

Google Scholar

[6] E.P. Wood, K.L. Nimmo, J. Electron. Mater. 23 (1994) 709-714.

Google Scholar

[7] F.T. Tan, X.L. Qiao and J.G. Chen, J. Applied Surface Science. 253 (2006) 703-707.

Google Scholar

[8] C.P. Wong, K.S. Moon and H. Dong, J. Electron. Mater. 34 (2005) 40-45.

Google Scholar

[9] L.L. Ye, Z.H. Lai, J. Liu and T. Anders, IEEE Transac. Electron. Pack. Manufact. 22 (1999) 299–302.

Google Scholar

[10] H.G. Busmann, B. Günther and U. Meyer, J. Nanostruct. Mater. 12 (1999) 531–534.

Google Scholar

[11] S. K, Anuar , M. Mariatti, A. Azizan and W.T. Tham, J. Mater. Sci. 22 (2001) 757-764.

Google Scholar

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