Application of High Aspect Ratio Scanning Probe in Microstructure Measurement

M.M. Fu; K.K. Guo; Y. Chen; Y.H. Yang; Bing Feng Ju

doi:10.4028/www.scientific.net/AMR.69-70.123

Paper Titles

Study on the Mechanical Properties of Sapphire by Numerical Simulation and Nanoindentation Technology
p.103

Examination to Machining Characteristics of Semi-Fixed Abrasive Plate during the Lapping Process
p.108

Investigation to Semi-Fixed Abrasives Plate Lapping SUS440 Stainless Steel
p.113

Laser Micromachining of Wide Bandgap Materials
p.118

Application of High Aspect Ratio Scanning Probe in Microstructure Measurement
p.123

Research on Prediction Model of Surface Roughness in Ultrasonic Polishing Nano-ZrO₂ Ceramics
p.128

Development of Elliptical Vibration Cutting Technology and its Application to Ultraprecision/Micro Machining of Hard/Brittle Materials
p.133

3D Profile Measurement of Nanometer Cutting Edges of Single-Point Diamond Tools for Ultra-Precision Machining
p.138

A New Internal Magnetic Field Assisted Machining Process Using a Magnetic Machining Jig-Machining Characteristics of Inside Finishing of a SUS304 Stainless Steel Tube
p.143

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 69-70Application of High Aspect Ratio Scanning Probe in...

Application of High Aspect Ratio Scanning Probe in Microstructure Measurement

Abstract:

An experiment, which is based on a self-developed pure tungsten high aspect ratio scanning probe, was conducted to measure the topography of a micro channel and a complex microstructure respectively. Comparison and analysis of both results by the tungsten probe and a single-crystal diamond probe were carried out. It indicates that the newly developed pure tungsten scanning probe has the capability in topography measurement, particularly fit for the high aspect ratio surface measurement.