Laser Micromachining of Wide Bandgap Materials

Y.T. Dai; Gang Xu; Wei Lai Li

doi:10.4028/www.scientific.net/AMR.69-70.118

Paper Titles

An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel
p.98

Study on the Mechanical Properties of Sapphire by Numerical Simulation and Nanoindentation Technology
p.103

Examination to Machining Characteristics of Semi-Fixed Abrasive Plate during the Lapping Process
p.108

Investigation to Semi-Fixed Abrasives Plate Lapping SUS440 Stainless Steel
p.113

Laser Micromachining of Wide Bandgap Materials
p.118

Application of High Aspect Ratio Scanning Probe in Microstructure Measurement
p.123

Research on Prediction Model of Surface Roughness in Ultrasonic Polishing Nano-ZrO₂ Ceramics
p.128

Development of Elliptical Vibration Cutting Technology and its Application to Ultraprecision/Micro Machining of Hard/Brittle Materials
p.133

3D Profile Measurement of Nanometer Cutting Edges of Single-Point Diamond Tools for Ultra-Precision Machining
p.138

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 69-70Laser Micromachining of Wide Bandgap Materials

Laser Micromachining of Wide Bandgap Materials

Abstract:

Owing to the large photo energy, 157nm laser is considered as one of promising micro-fabrication tools. In this paper, a micromachining system based on the 157nm laser is introduced. 2D laser direct-writing and 3D micro-structuring experiments are carried out for silica glasses, fibers and diamond. For natural diamond, the ablation threshold by 157nm laser is about 2.0J/cm2. Material removal is dominantly due to photon-chemical effect for 157nm laser ablation. Effectiveness of using 157nm laser for 3D micromachining is clearly demonstrated.