An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel

Ke Hua Zhang; Dong Hui Wen

doi:10.4028/www.scientific.net/AMR.69-70.98

Paper Titles

Microelectrode Array Fabrication by Micro-WEDM
p.79

Effect of Free Abrasive Particle in Gasbag Polishing Technique
p.83

Improvement of Diamond-Cutting Surface by Means of Porous Bearing Laminar Flow
p.88

Narrow Beam Machining on Micro-WEDM
p.93

An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel
p.98

Study on the Mechanical Properties of Sapphire by Numerical Simulation and Nanoindentation Technology
p.103

Examination to Machining Characteristics of Semi-Fixed Abrasive Plate during the Lapping Process
p.108

Investigation to Semi-Fixed Abrasives Plate Lapping SUS440 Stainless Steel
p.113

Laser Micromachining of Wide Bandgap Materials
p.118

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 69-70An Effect Contrast for Chemical Mechanical...

An Effect Contrast for Chemical Mechanical Polishing with Mechanical Polishing for Tungsten Steel

Abstract:

The interaction between the tungsten steel surface and the polishing fluid & abrasive were discussed by AFM, SEM and XRD test in order to compare the chemical performances and mechanical action of the tungsten steel polishing in the paper. The chemical mechanical polishing (CMP) and the mechanical polishing (MP) was employed, respectively. The experiments results indicated that the CMP with a higher the materials removal ratio than by MP. Because a chemical corrosion effect implies that slurries with the highest removal rate have high dissolution rate, and have a lower the residual stress, however the surface took on wrinkling.