Research on Modeling of Cutting Wire Deflection of Multi-Wire Saw

R. Tang; Y.X. Dai; Y.B. Zhang; Ju Long Yuan; Wan Li Xiong

doi:10.4028/www.scientific.net/AMR.69-70.343

Paper Titles

The Slurry for Glass Polishing by Micro Abrasive Suspension Jets
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The Diamond Wire Saw with a Nonmetallic Core
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Numerical Simulation on the Temperature Field of Water-Jet Guided Laser Micromachining
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The Design of Powder Feeding System for Laser Remanufacturing
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Research on Modeling of Cutting Wire Deflection of Multi-Wire Saw
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Research on On-Line Control Strategy for the Wearing Compensation of Polishing Wheel
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Analytical and Experimental Investigation of the Nickel Based Superalloy Using Cryogenic Cooling Grinding
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Research Progress of Advanced Machining Technologies for Engineering Ceramics
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Optimization of Ti-6Al-4V Flank Milling Parameters Using Taguchi Method
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 69-70Research on Modeling of Cutting Wire Deflection of...

Research on Modeling of Cutting Wire Deflection of Multi-Wire Saw

Abstract:

The deflection of cutting wire on multi-wire saw is determined by cutting wire tension, diameter ingot feed force and some other factors, and it affects the quality of silicon wafers greatly. In this paper, the initial stage of cutting process is analyzed and modeled with three ODEs. Then the numerical solutions are solved by finding out the BVPs of each ODE. The numerical solutions showed the relationship between the deflection and the cutting parameters such as cutting wire tension, diameter and ingot feed force. This method is helpful for the further research of modeling the entire cutting process.