Research on Modeling of Cutting Wire Deflection of Multi-Wire Saw

Abstract:

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The deflection of cutting wire on multi-wire saw is determined by cutting wire tension, diameter ingot feed force and some other factors, and it affects the quality of silicon wafers greatly. In this paper, the initial stage of cutting process is analyzed and modeled with three ODEs. Then the numerical solutions are solved by finding out the BVPs of each ODE. The numerical solutions showed the relationship between the deflection and the cutting parameters such as cutting wire tension, diameter and ingot feed force. This method is helpful for the further research of modeling the entire cutting process.

Info:

Periodical:

Advanced Materials Research (Volumes 69-70)

Edited by:

Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen

Pages:

343-347

DOI:

10.4028/www.scientific.net/AMR.69-70.343

Citation:

R. Tang et al., "Research on Modeling of Cutting Wire Deflection of Multi-Wire Saw", Advanced Materials Research, Vols. 69-70, pp. 343-347, 2009

Online since:

May 2009

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Price:

$35.00

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