Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

Ai Jie Ma; Qiu Yu Zhang; You Qiang Shi

doi:10.4028/www.scientific.net/AMR.690-693.1649

Paper Titles

The Best Dosage of Polymer Dispersant in WDG by Zata Potential Method
p.1632

The Surface Modification and Characteristics of Useful Expanded PTFE Composites by Photo-Radiation Methods
p.1636

Study on Pretreatment Agent for Anti-Clogging in Polymer Flooding Wells
p.1641

Synthesis of Poly(acrylic Acid Dodecyl Ester-Styrene-Maleic Anhydride) Terpolymer and Surface Modification of Glass Fiber
p.1645

Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin
p.1649

Aluminum-Induced Crystalization of Amorphous Silicon Films Deposited by Megnetron Sputtering
p.1655

Electrodeposition and Properties of CuInS₂ Thin Films
p.1659

On the Mechanism of Copper Oxide Reduction by Dielectric Barrier Discharge Plasma Using H₂ and Ar Mixture Gases
p.1664

Preparation and Properties of Cu₂ZnSnS₄ Nanoparticles by Solvothermal Method
p.1668

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 690-693Study on the Preparation of 2-Phenyl Imidazole...

Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

Abstract:

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester (PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope (SEM) and fourier transform infrared spectrum (FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

You might also be interested in these eBooks

Materials Design, Processing and Applications

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 690-693)

Pages:

1649-1652

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.690-693.1649

Citation:

Cite this paper

Online since:

May 2013

Authors:

Ai Jie Ma, Qiu Yu Zhang, You Qiang Shi

Keywords:

2-Phenyl Imidazole, Curing, Epoxy, Microcapsule

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Ansari S, Varghese J M, Dayas K R. Polydimethylsiloxane-cristobalite composite adhesive system for aerospace applications[J]. Polymers for advanced technologies, Vol. 20-5(2009), p.459.

DOI: 10.1002/pat.1294

Google Scholar

[2] Yuko S, Hiroyuki O, Misaki M, et al. Microcapsule type curing agent and curable resin composition containing the same: JP, 056891[P]. 2008-08-13.

Google Scholar

[3] Yuan Y C, Rong M Z, Zhang M Q. Preparation and characterization of microencapsulated polythiol[J]. Polymer, Vol. 49-10(2008), p.2531.

DOI: 10.1016/j.polymer.2008.03.044

Google Scholar

[4] Minami H, Kanamori H, Hata Y, et al. Preparation of microcapsules containing a curing agent for epoxy resin by polyaddition reaction with the self-assembly of phase-separated polymer method in an aqueous dispersed system[J]. Langmuir, Vol. 24-17(2008), p.9254.

DOI: 10.1021/la800188j

Google Scholar

[5] Shigeaki F, Yutaka O, Yoshii M. Microcapsule type latent curing agent for epoxy resin, method for producing the same, one-component epoxy resin composition, and epoxy resin cured product: JP, 158114[P]. 1993-09-24

DOI: 10.1021/acsapm.2c00138.s001

Google Scholar

[6] Shi Y Q, Zhang Q Y, Yin C J, et al . Preparation and applicat ion of m icrocapsule curing agent [ J] . China Adhesives, Vol. 19-58(2010), p.43.

Google Scholar