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On the Mechanism of Copper Oxide Reduction by Dielectric Barrier Discharge Plasma Using H2 and Ar Mixture Gases

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Abstract:

Dielectric barrier discharge (DBD) plasma was used to reduce copper oxide at atmospheric pressure using Ar and H2 mixture gases. Effect of H2 content on copper oxide reduction was investigated with a constant total flow rate of 100 mlmin-1 when the discharge voltage was kept at 36 kV. The composition of the copper oxide samples before and after DBD plasma treatment was characterized by X-ray diffraction (XRD). The results showed that energetic electrons and metastable Ar were inefficient for reduction of copper oxide in this study and the highest copper oxide reduction rate was obtained when the H2 content was 20%. In addition, no Cu2O was observed. Optical emission spectra (OES) were observed during reduction of copper oxide at different H2 contents, and the mechanism for copper oxide reduction using DBD discharge was discussed.

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Periodical:

Advanced Materials Research (Volumes 690-693)

Pages:

1664-1667

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.690-693.1664

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Online since:

May 2013

Authors:

Zhi Jian Xu, Bin Qi, Lan Bo Di

Keywords:

Copper, Copper Oxide, Dielectric Barrier Discharge (DBD), Metastable H2 Molecules, Optical Emission Spectra (OES)

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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