Thermal Performance Analysis of the Molecular Linkers in the Carbon Nanotube Composites under Stress Conditions

Jie He; Xiao Jin Zhang; Zhi Tao; Ye Xin Xu; X. WU

doi:10.4028/www.scientific.net/AMR.699.179

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 699Thermal Performance Analysis of the Molecular...

Thermal Performance Analysis of the Molecular Linkers in the Carbon Nanotube Composites under Stress Conditions

Abstract:

The influence of the stress type, stress size and polymer chain number on the thermal performance of the molecular linker was investigated by the nonequilibrium molecular dynamics method (NEMD). The results demonstrate that the thermal conductivity of molecular linker first increases and then decreases with an increment in tension because of the interaction between the phonon mean free path and spectrum red-shifted of the molecular linker. While the molecular linker is in compression, the thermal conductivity is linear relationship with the magnitude of the force. With the length compressed to 90%, the thermal conductivity can be decreased 70% maximally. Moreover, increasing the polymer chain number can improve effectively the thermal performance and the anti-deformation ability of the molecular linker.

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Periodical:

Advanced Materials Research (Volume 699)

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179-183

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.699.179

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Online since:

May 2013

Authors:

Jie He, Xiao Jin Zhang, Zhi Tao, Ye Xin Xu, X. WU

Keywords:

Molecular Linker, Stress, Thermal Conductivity (TC)

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