Study on Improvement of Surface Temperature Uniformity by Bubble Stabilization in Flat-Plate Heat Pipe Hot Chuck

Dae Hyeon Kim; Kyung Il Cha; Seok Ho Rhi; Kye Bock Lee

doi:10.4028/www.scientific.net/AMR.711.251

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 711Study on Improvement of Surface Temperature...

Study on Improvement of Surface Temperature Uniformity by Bubble Stabilization in Flat-Plate Heat Pipe Hot Chuck

Abstract:

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ±1.5% during heating to 120°C. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type (300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various screen mesh (40, 80, 120) were used as the structure and chamber was changed.

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Periodical:

Advanced Materials Research (Volume 711)

Pages:

251-256

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.711.251

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Online since:

June 2013

Authors:

Dae Hyeon Kim, Kyung Il Cha, Seok Ho Rhi, Kye Bock Lee

Keywords:

Bubble Stabilization, Heat Pipe, Surface Temperature, Uniformity

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References

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