The Etching Reaction and Surface Reconstruction of Bismuth Zinc Niobate Thin Film in SF6/Ar Plasma

Article Preview

Abstract:

Reactive ion etching (RIE) of bismuth zinc niobate (BZN) thin films using an SF6/Ar plasma has been studied. An optimum process parameters was obtained according to the highest etch rate of 90nm/min. Under this etching condition, the crystal structural properties and surface morphology of the BZN film before and after etching were characterized using X-ray diffraction (XRD), the film showed a surface reconstruction after etching, a cubic pyrochlore structure orientation transition was observed from preferential (222) to (400), and ZnF2 phases were detected. The film surface was chemically analyzed by X-ray photoelectron spectroscopy (XPS) to investigate the reactive ion etching mechanism. A zinc-rich surface was formed because low-volatile ZnF2 residues were difficult to remove.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

28-32

Citation:

Online since:

September 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2013 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] H. J. Youn, T. Sogabe, C. A. Randall, T. R. Shrout, and M. Lanagan, Phase relations and dielectric properties in the Bi2O3-ZnO-Ta2O5 system,J . Am. Ceram. Soc. 84(2001) 2557-2562.

DOI: 10.1002/chin.200207008

Google Scholar

[2] J. Nino, M. T. Lanagan, and C. A. Randall, Phase formation and reactions in the Bi2O3-ZnO-Nb2O5-Ag pyrochlore system, J. Mater. Res. 16 (2001) 1460-1464.

DOI: 10.1557/jmr.2001.0203

Google Scholar

[3] R. L. Thayer, C. A. Randall, and S. Trolier-McKinsky, Medium permittivity bismuth zinc niobate thin film capacitors, J. Appl. Phys. 94 (2003) 1941-(1947).

DOI: 10.1063/1.1590415

Google Scholar

[4] S.W. Jiang, B. Jiang, X. Z. Liu, and Y. R. Li , Laser deposition and dielectric properties of cubic pyrochlore bismuth zinc niobate thin films , J. Vac. Sci. Technol. 24 (2006) 261-263.

DOI: 10.1116/1.2165665

Google Scholar

[5] H. Wang, R. Elsebrock, T. Schneller, R. Waser, X. Yao, Bismuth Zinc Niobate (Bi1. 5ZnNb1. 5O7) ceramics derived from metalloorganic decomposition precursor solution, Solid State Commun. 132 (2004) 481-486.

DOI: 10.1016/j.ssc.2004.07.071

Google Scholar

[6] W. Ren, S. Trolier-McKinstry, C. A. Randall and T. R. Shrout, W. Ren, S. Trolier-McKinstry, C. A. Randall and T. R. Shrout, Bismuth zinc niobate pyrochlore dielectric thin films for capacitive applications, J. Appl. Phys. 89(1) (2001) 767-774.

DOI: 10.1063/1.1328408

Google Scholar

[7] Y. P. Hong, S. Ha, H. Y. Lee, Y. C. Lee, Voltage tunable dielectric properties of rf sputtered Bi2O3-ZnO-Nb2O5 pyrochlore thin films, Thin Solid Films. 419 (2002)183-188.

DOI: 10.1016/s0040-6090(02)00744-7

Google Scholar

[8] J. W. Lu and S. Stemmer, Low-loss, tunable bismuth zinc niobate films deposited by RF magnetron sputtering, Appl. Phys. Lett. 83 (2003)2411-2413.

DOI: 10.1063/1.1613036

Google Scholar

[9] A. Magna, G Garozzo, Factors affecting profile evolution in plasma etching of SiO2, J. Electrochem. Soc 150 (2003)F178-185.

DOI: 10.1149/1.1602084

Google Scholar

[10] G. Liu, Y. Kuo, Additive gas effect on the Cl2 plasma-based copper etch process and sidewall attack, J. Electrochem. Soc. 155 (2008)H97-H102.

DOI: 10.1149/1.2816329

Google Scholar

[11] E.L. Lim, J.H. Teng, L.F. Chong, N. Sutanto, S.J. Chua, S. Yeoh, Inductively Coupled Plasma etching of InP with HBr/O2 chemistry, J. Electrochem. Soc. 155 (2008)D47-D51.

DOI: 10.1149/1.2801872

Google Scholar

[12] G. Liu and Y. Kuo, Electromigration of copper lines patterned with a plasma- based etch process, J. Electrochem. Soc., 156(6) (2009) H579-H584.

DOI: 10.1149/1.3129579

Google Scholar

[13] P. Shi , X. Yao , L.Y. Zhang, Reactive ion etching of sol-gel-derived BST thin film, Ceramics International, 30(2004)1513-1516.

DOI: 10.1016/j.ceramint.2003.12.125

Google Scholar

[14] M. Bale, R.E. Palmer, Deep plasma etching of piezoelectric PZT with SF6, J. Vac. Sci. Technol. B. 19 (2001) 2020-(2025).

DOI: 10.1116/1.1409392

Google Scholar